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PCBs are an innovation. PCBs have made circuits sturdy, small and neat as compared to early boards. This is the through hole technology of PCB fabrication. With time and requirement, the size if the PCB started appearing bigger. As this is an era of miniaturization, further reduction in size of the PCB was required. To cater to miniaturization of the circuits, surface mount technology came into effect. The components lack leads and can be soldered on the same side of the board where the circuit is.
Features of the surface mount technology
As the name suggests, components are placed on the same surface where the circuit design is soldered. This saves the other surface of the PCB substrate and it can also be utilized to design a circuit and placement of circuit components. The circuit components for surface mount technology are different from conventional components. They are flat profiled, small and give minimum height and length to the circuit.
A metallic bed is prepared for them on the circuit. The components have metallic ends. The components are placed on the bed and are soldered on the same surface. Even though they are on the same surface, a few holes need to be drilled on the board to connecting the circuits through on the two surfaces. These are called vias. They are useful in expelling heat from a circuit.
Circuit components are designed specifically for surface mount boards, ICs, resistors, capacitors, etc. all come in a very miniature and small flat profiled form. The main and the basic motive is to minimize the circuit.